A reliable method for detecting soldering errors on circuit boards has been developed by the heavy industries division of Mitsubishi in Japan. Three perpendicular laser beams just five micrometers wide are fired at the solder tracks, sending three-dimensional data to a microprocessor. The shape of each track - especially the adhesion angle and height - is assessed to decide whether the sol- der is good or defective. The method is 10 times more reliable than existing automated systems (New ScientisA Vol 160, No 2160).
We are a voice to you; you have been a support to us. Together we build journalism that is independent, credible and fearless. You can further help us by making a donation. This will mean a lot for our ability to bring you news, perspectives and analysis from the ground so that we can make change together.
.png)
Comments are moderated and will be published only after the site moderator’s approval. Please use a genuine email ID and provide your name. Selected comments may also be used in the ‘Letters’ section of the Down To Earth print edition.